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个人信息Personal Information
讲师
硕士生导师
性别：女
毕业院校：大连理工大学
学位：博士
所在单位：集成电路学院
联系方式：mhr@dlut.edu.cn （微信：Mahr-DLUT）
电子邮箱：mhr@dlut.edu.cn
扫描关注
- [1]Dong, Chong, Shang, Min, 郭莹, Chen, Xiangxu, 张军, Changlong, 马浩然, 马海涛.Significant Effect of Temperature and Solders on the Growth Behavior of CU6Sn5on (110) Cu Single ...[A],2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021,2022
- [2]姚金冶, 王立, 郭世浩, 李孝夫, 陈祥序, 赏敏, 马浩然, 马海涛, Ma, Haitao.First-Principles Study of Cu Addition on Mechanical Properties of Ni3Sn4-Based Intermetallic Comp...[J],METALS,2024,14(1)
- [3]Zhang, Liyuan, 张力元, 缑敏, 马浩然, 夏晓川, 梁红伟, Ma, Haoran, Xia, Xiaochuan.Laser Etching Process of TSV and Reliability Analysis of TSV-based IC structure by Finite Element...[A],2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT,2011
- [4]赏敏, 姚金冶, 张丹, 苏小林, 马海涛, 王云鹏, 马浩然, Ma, Haitao, Wang, Yunpeng.Preparation and soldering performance of SAC305@Sn-bi Core-shell solder balls based on eutectic c...[J],MATERIALS CHARACTERIZATION,2024,211
- [5]潘帅屹, 许慧敏, 谭昕, Xu, Huimin, Tan, Xin, 马浩然, 夏晓川, 梁红伟, Ma, Haoran.Reliability Modeling of High Power DUV LED Chips Based on New Thin Film Packaging Technology[A],2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT,2011
- [6]Liang, Shuibao, Wei, Cheng, Kunwar, Anil, Subedi, Upadesh, Jiang, Han, 马浩然, Ke, Changbo, Kunwar.Phase field modelling combined with data-driven approach to unravel the orientation influenced gr...[J],SURFACES AND INTERFACES,2023,37
- [7]董冲, 马浩然, 马海涛, 王云鹏, Ma, Haitao.Nucleation and growth of intermetallic compounds on the prefabricated Cu6Sn5 layer[J],Materials Chemistry and Physics,2023,296
- [8]张丹, Zhang, Dan, 董冲, 郭天浩, 马海涛, 王云鹏, 马浩然, Ma, Haitao, Wang, Yunpeng, Ma, Haoran.Enhanced Shear Strength of Sn-Bi/(111)Cu Joints by Refined Distribution of Bi in the Composite So...[J],Journal of Electronic Materials,2024,53(8):4539-4543
- [9]Chen, Le, 王德煜, 韩中元, 马浩然, Liu, Caiyun, Tai, Jiajin, 梁红伟, Yin, Hong, Liang, Hongwei, Yin.Covalent Heteroepitaxy of Large-Area Vertical Hexagonal Boron Nitride for High-Temperature VUV Ph...[J],Laser and Photonics Reviews,2024
- [10]刘笛, Liu, Di, 白天越, 乔媛媛, 董伟, 赵宁, Bai, Tianyue, Qiao, Yuanyuan, 马浩然, Dong, Wei, Zhao, Ning, Ma, Haoran, Qiao, Zhao.Laser jet solder ball bonding of SAC305/Cu BGA joints: Microstructure, temperature field simulati...[J],MATERIALS CHARACTERIZATION,2024,215
- [11]赏敏, Shang, Min, 姚金冶, 邢警, 刘向卿, 王云鹏, 马海涛, Yao, Jinye, Xing, Jing, Liu, Xiangqing, Wang, Yunpeng, 马浩然, Ma, Haitao.Ni and Ni-P substrates inhibit Bi phase segregation and IMC overgrowth during the soldering proce...[J],MATERIALS CHEMISTRY AND PHYSICS,2024,325
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